Order
Our alpha product is a powerful tool that showcases the core technology of direct deposition patterning.
Single-Step Patterning: Streamlined process for faster design cycles.
High Material Utilization: Reduced waste and improved efficiency.
Flexible Design: Create intricate 2D or 3D patterns with precision.
Features
- 50 um lateral patterning resolution
- 8" (200 mm) wafer processing
- 50-400 °C processing temperature
- ALD precursors compatible
To be among the first to experience direct deposition patterning, reserve your alpha product now!
Demos
Experience the power of direct deposition patterning firsthand.
Our expert team will guide you through a tailored demonstration, showcasing the capabilities of our technology and its potential to transform your specific application.
Our Demo Process
- Consultation: We will work closely with you to understand your specific needs and requirements.
- Design and Simulation: Our engineers will design and simulate the optimal patterning path for your application.
- Sample Fabrication: We will fabricate samples on our system, demonstrating the precision and flexibility of our technology.
- Data Analysis: We will provide detailed analysis of the fabricated samples, including material properties, application performance and estimated cost savings.
Reach out to us at [email protected] to request a demo today!
About
Szimpla is at the forefront of semiconductor innovation, revolutionizing the industry with our groundbreaking direct deposition patterning technology. By combining the precision of Atomic Layer Deposition (ALD) with the flexibility of 3D printing, we are unlocking new possibilities in material development and semicondcutor manufacturing.
Make Patterning Simple
Our mission is to simplify the patterning process and empower our customers by providing direct deposition patterning solutions that simplify device fabriaction to accelerate innovation and drive industry growth.
Our Technology
Our novel technology enables single step patterning, eliminating the complex, multi-step processes to streamline your workflow.
All while utilizing ALD combined with our high resolution patterning process, our systems are able to deposit thin films with 50 um lateral resolution and nanometer thicknesses.
We integrate 3D device design for enhanced design flexibility to create intricate 3D structures and complex patterns with a lateral step resoultion of 0.1 um.
Accelerating design development cycles and bringing your innovations to market faster.
Reach out to us at [email protected] to learn more about our technology and how it can benefit your business.
Contact
Get in touch via email [email protected] or reach out on social media.
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